Every Spin-Off
Mi Material Holding
Date setMYMakes solder spheres, the tiny metal balls that connect chips to circuit boards in advanced packaging, plus solder paste and preforms, at plants in Taiwan, China and Malaysia for chipmakers and packaging houses.
Mi Technovation's semiconductor materials business (Mi Material Holding Pte Ltd) is to be listed on the SGX Mainboard, with the parent keeping about 72.61% after listing.
- Status
- Date set
- Expected
- SGX listing Oct 2026
- Parent
- Mi Technovation (5286 MK)
- Spin-off ticker
- To be announced
- Listing
- SGX Mainboard
- Market
- Malaysia
- Sector
- Information technology
Terms
Dividend-in-specie of up to 9 million Mi Material shares at 1 share for every 100 Mi Technovation shares held, alongside the SGX listing; needs EGM approval and listing approvals; SGX granted conditional eligibility on 25 Aug 2026; entitlement date to be set after approvals. Entitlement date 12 Oct 2026 (1 Mi Material share per 100 Mi Technovation shares, about 8.98m shares); SGX IPO launched 19 Oct 2026 at S$1.80, raising S$203.2m.
Key dates
- Listing proposal announced
- Dividend-in-specie proposed
- SGX conditional eligibility letter
- EGM
- Entitlement date and SGX listing
- Entitlement date
- SGX IPO launched at S$1.80
Source documents
- Press releaseDividend-in-specie proposal (07/21/26)
- PresentationNot yet published
- Prospectus / demerger documentNot yet public
- Sourcebusinesstoday.com.my (SGX eligibility)
- Sourcethestar.com.my (listing proposal)
- Sourceklsescreener.com, SGX listing launched at S$1.80 (19 Oct 2026)
Every Spin-Off research
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